Brief:Shanghai | Full-time | R&D Management Center 1. Bachelor degree or above, major in electronics; 2. Have experience in semiconductor front-end/packaging testing.
Brief:Chongqing | Full-time | Technical Department 1. Bachelor degree or above, major in materials science, chemistry, physics, microelectronics and other related science and engineering disciplines; 2. More than 3 years of experience in wafer electroplating process in the semiconductor industry, familiar with the principles of the electroplating process; 3. Good language expression skills, communication and coordination skills and execution ability, with team spirit; 4. Applicants with experience in establishing new Fab or wafer plating process in the semiconductor industry will be given priority.
Brief:Shanghai | Full-time | R&D Management Center 1. Bachelor degree or above, major in electronics; 2. Have experience in product definition and formulating product specifications and proposing R&D requirements based on customer needs.
Brief:Shanghai | Full-time | R&D Management Center 1. Bachelor degree or above, major in electronics; 2. Use spice/PADS and other software circuit simulation and PCB board drawing, circuit testing and debugging.
Brief:Shanghai | Full-time | R&D Management Center 1. Bachelor degree or above, major in electronics; 2. Have experience in integrated circuit & PCB layout design.
Brief:Shanghai | Full-time | R&D Management Center 1. Bachelor's degree, master's degree or above, major in materials or chemistry. 2. Have semiconductor process experience or MEMS product experience.
Brief:Shanghai | Full-time | R&D Management Center 1. Master's degree, Ph.D. or above, major in mathematics, physics, materials, and electronics; 2. Be fluent in using finite element simulation tools (Comsol/Ansys for thermo-mechanical electro-optical fluid simulation), and have experience in semiconductor work or MEMS device development.
Brief:Chongqing | Full-time | Financial Management Department 1. Possess a full-time undergraduate degree or above in accounting or finance-related majors, and an intermediate accounting or above professional title; 2. Applicants with 5 or more years of experience in cost management of large and medium-sized manufacturing companies and in the semiconductor industry are preferred; 3. Those who are proficient in financial software and office software, and those who participate in the ERP implementation process will be given priority; 4. Good communication skills, solid accounting professional knowledge, and familiarity with various accounting regulations; 5. Work meticulously and rigorously, with strong logic and sense of responsibility.
Brief:Chongqing | Full-time | Financial Management Department 1. Possess a full-time undergraduate degree or above in accounting or finance-related majors, and an intermediate accounting or above professional title; 2. Applicants with 5 years or more of general ledger accounting experience in large and medium-sized manufacturing companies, and experience in the semiconductor industry will be given priority; 3. Proficient in financial software and office software, and familiar with taxation, industrial and commercial, banking and other businesses; 4. Good communication skills, solid accounting professional knowledge, and familiarity with various accounting regulations; 5. Work meticulously and rigorously, with strong logic and sense of responsibility.
Brief:Chongqing | Full-time | Quality Department 1. Bachelor degree or above, under 45 years old; 2. Priority will be given to those majoring in polymer materials and chemistry, familiar with the IC substrate production process, and have more than 10 years of experience in managing the process department; 3. Be familiar with the process flow, equipment, materials, processes and control points involved in the IC substrate manufacturing process; 4. Have strong management skills and pressure resistance, be able to lead the team to complete various task indicators assigned by the company, and be good at communication and coordination; 5. Applicants with experience in packaging substrate factory preparation and process design will be given priority.
