Electroplating Process Engineer

Job Requirements

Chongqing | Full-time | Technical Department

1. Bachelor degree or above, major in materials science, chemistry, physics, microelectronics and other related science and engineering disciplines;
2. More than 3 years of experience in wafer electroplating process in the semiconductor industry, familiar with the principles of the electroplating process;
3. Good language expression skills, communication and coordination skills and execution ability, with team spirit;
4. Applicants with experience in establishing new Fab or wafer plating process in the semiconductor industry will be given priority.

Job Responsibilities

1. Responsible for the selection, introduction and testing of electroplating equipment;

2. Responsible for electroplating-related raw material evaluation, certification, testing, etc.;

3. Responsible for the compilation and training of electroplating process CP/FMEA/SOP;

4. Based on product needs, be responsible for the development of new process flows and meet mass production needs;

5. Responsible for the daily maintenance of the electroplating process, establishing a process risk management and control system, timely discovering and solving quality hazards, and ensuring the stability of the process.

Deliver immediately

Glassmicro (Chongqing) Semiconductor Tech. Co., Ltd

Focus on the R&D, design, production and sales of glass-based IPD products and TGV three-dimensional optoelectronic packaging products.

About Glassmicro

Products Center

Contact Us

Head Office Address:

East side of Panlong Road, Fuling High-tech Zone, Chongqing, south side of Xien Factory

E-mail: liuting@glassmicro.com

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