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Management Team

Xu HongGuang
Chairman / General Manager / CEO
Ph.D. from Shanghai University, general manager. He has worked in Shanghai Radio and Television, Leybold High-tech, etc., engaged in the research and development and management of pan-semiconductor technology, and has served as engineer, senior engineer, director, manager, etc. Specializing in the development and production of pan-semiconductor materials and devices for more than 20 years, and research on microelectronics and integrated circuits for more than 15 years. As the project leader, he has been directly responsible for and participated in nearly 20 national and Shanghai major/key projects. He has won the title of Shanghai Youth Science and Technology Star, the China International Industrial Expo Innovation Award, etc. It has published dozens of academic papers in core domestic and foreign magazines, applied for dozens of patents, and formulated several product and technical standards.
Pu XianYong
Deputy General Manager / CTO
Ph.D. Candidator from Fudan University, deputy general manager, CTO, head of R&D technology. He has worked in Singapore SSMC and SMIC with more than 25 years of work experience. He is the head of the SPECIALITY technology (PMIC,MEMS,Optoelectrics) manufacturing department and has long been committed to the production and development of semiconductor materials, devices, and products. etc., with more than 25 years of experience in the semiconductor industry. During the work, he led the team to complete dozens of product developments and won the third prize of Shanghai Science and Technology Progress Award.
Yang Lin
Deputy General Manager/CMO
Master of Tsinghua University, deputy general manager, and CMO manufacturing process leader. He has worked for Xingsen Express, Pengding Holdings, and other companies, leading the investment in 2.2 billion integrated circuit projects to implement the layout, equipment selection, installation and commissioning, and organization of production and operation. He has extensive experience in electronic circuit product design, mass production process debugging and optimization, production line, semiconductor, and packaging carrier board factory operation management. He is a senior engineer of electronic components and a member of the Board of Directors of the Electronic Circuit Industry Association. He has presided over and participated in 3 provincial and municipal scientific research projects, more than 100 major corporate technological research projects, published 2 papers, and obtained more than 30 invention and utility model patents.
Huang WeiDong
Deputy Director of R&D
Ph.D. in Materials Physical Chemistry, Shanghai Institute of Microsystems, Chinese Academy of Sciences
R&D Director of the Advanced Packaging Division. He has worked for Freescale Semiconductor China Co., Ltd., Huajin Semiconductor Packaging Leading Technology R&D Center Co., Ltd., and Jiejie Microelectronics (Shanghai) Technology Co., Ltd. He has rich experience in 2.5D, 3D, fanout, chipset heterogeneous integration, and other advanced packaging and thermal electromechanical joint simulation analysis.
Glassmicro (Chongqing) Semiconductor Tech. Co., Ltd
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