As an innovative company, it has a core R&D team composed of senior experts and outstanding talents in the industry. The team members are experts and veterans in the fields of IC, FPDl, and PCB, truly realizing cross-border innovation and integration. The team has always paid attention to the future development trends of the semiconductor packaging industry, focusing on the research and development of glass-based semiconductor products. Relying on internationally advanced R&D equipment and manufacturing processes, it has successfully developed a variety of high-performance, low-power microelectronic chips, and other products to provide customers with providing a full range of microelectronics solutions that have been recognized by well-known customers at home and abroad. The company will build a special process chip production line in 2024, with an annual production capacity of 2 billion glass-based chips. In 2025, it plans to expand the production capacity of the second phase of the production line to achieve an annual production of 4 billion IPD chips, while also adding packaging and testing capacity.