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core competitiveness

At present, the company has established an industry-university-research cooperation model with Southeast University, Shanghai University, and the Institute of Intelligence, Hefei Research Institute of the Chinese Academy of Sciences. It has nearly 30+ patents under review, and 2 invention patents have been authorized during the period. It is expected that by the end of 2025, the company's various There will be more than 120 patents, including no less than 30 invention patents.
team

Comprehensive composite team

  • Have an experienced and technically competent R&D team
  • Senior teams in the three industries of IC, FPD, and packaging including design, technology, production, and sales
  • Comprehensive industrial composite team including operation and management
product

Breakthrough in product definition

  • Based on the pain points of silicon-based chips, define product designs across industries and completely solve industry difficulties.
  • Based on glass carrier, heterogeneous integration
Advanced design concepts

Advanced design concepts

  • Design integrated chips based on glass carrier compatible panel process
  • Heterogeneous integrated design based on glass, silicon and III-V clusters
  • COG isolation technology, high-voltage structure technology, chip stacking technology (CSoG)…
Excellent process capabilities

Excellent process capabilities

  • Integration of processes in the three industries of integrated circuits, optoelectronic displays, and packaging carrier boards
  • Heterogeneous process capabilities across materials and industries
  • TGV technology, UTG process technology, special metal manufacturing technology, low-cost manufacturing technology...
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Glassmicro (Chongqing) Semiconductor Tech. Co., Ltd
Focus on the R&D, design, production and sales of glass-based IPD products and TGV three-dimensional optoelectronic packaging products.
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East side of Panlong Road, Fuling High-tech Zone, Chongqing, south side of Xien Factory
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