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Cutting Process Engineer

Job Requirements

Chongqing | Full-time | Technical Department
1. Bachelor degree or above, major in science and engineering such as photoelectric control, mechanical automation;
2. Work experience related to Glass core blades and laser cutting lobes;
3. Good language expression skills, communication and coordination skills and execution ability, with team spirit;
4. More than 3 years of working experience in the semiconductor wafer industry.

Job Responsibilities

1. Responsible for the selection and evaluation of new etching equipment, and the introduction and debugging of new materials;

2. Responsible for writing operating instructions related to the cutting process and formulating process management procedures;

3. According to product needs, be responsible for the development of new process flows and meet mass production needs;

4. Responsible for the daily maintenance of the cutting process, establishing a process risk management and control system, timely discovering and solving quality hazards, and ensuring the stability of the process.

Glassmicro (Chongqing) Semiconductor Tech. Co., Ltd
Focus on the R&D, design, production and sales of glass-based IPD products and TGV three-dimensional optoelectronic packaging products.
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